2-2 Halogen-free solder pastes
2-2-1 Product Characteristics:
- Adopt lead-free environment-protection alloy and helogeno-free flux, meet the RoHS directive.
- New Technical support, special chemical ingredient, provide with favorable wettability to make up for poor wettability of lead-free alloy to ensure high reliability.
- Little residue after reflowing which has no corrosion and good electrical insulation.
- Adopt high-efficiency thixotropic agent to prevent subseidence as preheating and printing.
- Meet the American standard of ANSI/J-STD-004 flux (ROLO).
- The diameter of tin powder is accurately controlled between 25μm to 45μm, and the flux is specifically made to insure continuously printing and fine pattern.
- Advanced moisture-keeping technology and persistent viscidity ( viscosity above 48 hours), more than 8 hours of valid working life.
- The residue is clear and has little influence to test.
- Lucent soldering point and other favorable performance.
2-2-2 Designation, Melting Point and Alloy Compositions
| Series |
Melting point(℃) |
Alloy compositions |
| WH-326G-R（2-2） |
217-220 |
S-Sn96.5Ag3Cu0.5Ce |
| WH-373G-R（2-2） |
216-228 |
S-Sn99Cu0.7Ag0.3 |
| WH-210G-R（2-2） |
340-240 |
S-Sn95Sb5 |
2-2-3 Flux Chemical Composition
| Materials |
Content(wt%) |
| Resin |
40 |
| Thixotropic agent |
11 |
| Acid |
3 |
| Solvent |
37 |
| Corrosion inhibitor |
3 |
| Viscosity additive |
2 |
| Active polymer |
2 |
2-2-4 Properties
| Item |
Data |
| Halogen content (%) |
N.D |
| SIR(Ω) |
Before soldering |
＞1×1012 |
| Moist resistance |
＞1×1010 |
| Flux content(Wt%) |
11.5±1.0 |
| Metal content(Wt%) |
88.5±0.5 |
| Powder size(μm) |
25~45 |
| Viscosity (Kcps/Pa.s) |
180±30 |
| Copper mirror corrosion |
Low |
| Copper plate corrosion |
Low, accepted |
| Collapse test |
pass |
| Wetting test |
pass |
| Shelf life |
6 Months (0-10℃) |
