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Home About us Enterprise Introduction Basic Elements of Enterprise ISO9001 ISO14001 Quality Policy Environment Policy Products Center SMT solder pastes Lead-free solder wires Lead-free solder bars No cleaning flux H-L temperature solders Technical supports Presentation of new products plans for new products SMT technology exchange Exchange of wave solding technology SMT temperature profile Satety Data Sheet Proprietary product Contact Messages Order 中文版

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	Technical support	Presentation of new products plans for new products SMT technology exchange Exchange of wave solding technology SMT temperature profile Satety Data Sheet 7-1 Innovative Sn-Cu Eutectic base Solder with higher Creep Resistance 7-2 The productions of water based liquid welding flux 7-3 High temperature lead-free solder alloy development 2-5 Solder Paste Operation Manual 2-6 Malfunction Analysis 2-7 Quality Control Diagram 2-8 Test Items of Leaving-Factory 2-9 Storage,Package and Trademark 6-7 Operation Manual for Flux 6-10 FQA SMT Temperature Profile Parameters 2-10 Solder Paste Safety Data Form 3-8 Lead-free Solder Wire Safety Data Form 4-7 Lead-free Solder Bar Safety Data Form 6-12 Flux,Cleaner and Thinner Safty Data Form
2-8 Test Items of Pre-Delivery Viscosity Flux Activity Copper corrosion test Flux content Wetting Test Solder Ball Test Typical Adhesive(gf) Collapse test A typical SIR test, running 168 hours